"BGA Rework / BGA Reballing" *Available from just one unit!
Over 50,000 rework achievements for BGA with a pitch of 0.35 to 1.27mm! Even for just one piece, you can trust us with circuit boards that have underfill applied!
Our company performs "BGA rework and reballing" using IPC-recommended IR rework equipment (7 units owned). We have a track record of reworking over 100,000 BGA components with pitches ranging from 0.35 to 1.27mm, as well as reballing over 50,000 BGA components with ball diameters from Φ0.2 to 0.76mm. We can also accommodate copper core balls. We can handle requests starting from just one piece, and we are capable of working on circuit boards with underfill applied, as well as replacing QFN and connector components. We can also address components that are difficult to replace. Please feel free to consult with us. 【Features】 ■ BGA and QFN Rework - Over 100,000 BGA rework achievements with pitches from 0.35 to 1.27mm - Achievements with 1,300 special QFN components - Capable of handling difficult-to-replace components - Analysis of soldering conditions using X-ray observation equipment with CT functionality ■ BGA Reballing - Over 50,000 reballing achievements for BGA components with ball diameters from Φ0.2 to 0.76mm - Capable of handling components with underfill applied - Can manage the entire process from BGA removal to reballing to rework *For more details, please refer to the PDF document or feel free to contact us.
- Company：ビオラ
- Price：Less than 10,000 yen
